Sputtering method and apparatus with small diameter RF coil

Details Sputtering method and apparatus with small diameter RF coil Sputtering method and apparatus with small diameter RF coil

1998-04-22

2000-11-14

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429808, 20419212, C23C 1434

Patent

active

061465089

ABSTRACT:
An apparatus and method for sputtering ionized material onto a workpiece with the aid of a plasma which ionizes the material, utilizing: a support member having a workpiece support area for supporting a workpiece that has a given diameter; a target constituting a source of material to be sputtered; and a coil located between the target and the workpiece support for creating a plasma which ionizes material sputtered from the target, the coil enclosing a region, the support member being maintained at a potential which causes ionized material to be attracted to the support member. The coil is configured and operated to shape the plasma in a manner to promote redirection of material sputtered from the center of the target back to the target.

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