Sputtering method and apparatus

Details Sputtering method and apparatus Sputtering method and apparatus

2008-11-21

2011-10-25

Young, Christopher (Department: 1721)

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

C204S192130, C204S298030, C204S298200

Reexamination Certificate

active

08043481

ABSTRACT:
A sputtering method deposits a film on a substrate by controlling a magnetic field parallel to a surface of a target so that the magnetic field at a part of the target, other than parts of the target which are sputtered during a deposition mode in which a deposition process is performed with respect to the substrate, has an intensity lower than an arbitrary intensity at the other parts during the deposition mode and has an intensity higher than or equal to the arbitrary intensity during a standby mode in which the deposition process is not performed. A redeposited film which is deposited on the part of the target during the deposition mode is removed by performing a sputtering during the standby mode.

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