Sputtering device and method for reactive for reactive sputterin

Details Sputtering device and method for reactive for reactive sputterin Sputtering device and method for reactive for reactive sputterin

1995-04-25

1998-12-15

Nguyen, Nam

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

2041922, 20429803, 20429807, 20429819, 20429824, 20429826, C23C 1434

Patent

active

058491627

ABSTRACT:
A method for reactive sputter coating in a chamber in which large substrates to be coated are transported past one or more coating stations. The stations are comprised of at least one sputtering target and at least one adjacent plasma generator. In the practice of this invention the sputtering and reaction zones within the chamber are indistinguishable.

REFERENCES:
patent: 4492620 (1985-01-01), Matsuo et al.
patent: 4851095 (1989-07-01), Scobey et al.
patent: 5122252 (1992-06-01), Latz et al.
patent: 5169509 (1992-12-01), Latz et al.
patent: 5292417 (1994-03-01), Kugler

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