Sputtering device

Details Sputtering device Sputtering device

1994-12-20

1996-07-16

Weisstuch, Aaron

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

C23C 434

Patent

active

055363814

ABSTRACT:
A sputtering device for improving adhesion of a deposited film by attaching a grating set to a shield is provided. The sputtering device comprises a sputtering chamber, a first electrode which supports a substrate and is used as an electrode within the sputtering chamber, a target composed of a source material to be sputtered toward the first electrode, a second electrode attached to the target, a shield which is insulated from the second electrode and attached beneath the target, and a grating set which is attached to the shield, for changing the paths of the sputtered particles. The path of particles moving near the shield during sputtering, e.g., sputtered particles or neutralized plasma ions, is changed into a vertical direction with respect to the substrate via the grating set. As a result, the film formed over the whole surface of the substrate has a compressive stress, thereby improving the adhesion.

REFERENCES:
patent: 5223108 (1993-06-01), Hurwitt
patent: 5393398 (1995-02-01), Sugano

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