Sputtering cathode for coating substrates in cathode sputtering

Details Sputtering cathode for coating substrates in cathode sputtering Sputtering cathode for coating substrates in cathode sputtering

1991-02-11

1992-07-28

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429818, 20429819, 20429821, C23C 1434

Patent

active

051338505

ABSTRACT:
Cathode base (1) has a hollow target (8) disposed thereon with at least one planar sputtering surface (8a), of circular shape for example, which is encompassed by at least two concentric, continuous projections (8b, 8c), and with a magnet system (6) with pole faces (6c, 6d) of opposite polarity lying on both sides of the target (8) for the production of magnetic lines of force (11, 11', . . . ) running substantially parallel to the sputtering surface (16a), the wall surfaces (8d, 8e) of the projections (8b, 8c) of the target (8), adjoining the sputtering surface (8a) being disposed at an angle (.alpha.) to the perpendicular, is preferably in a range between 30 and 70 degrees.

REFERENCES:
patent: 4100055 (1978-07-01), Rainey
patent: 4370217 (1983-01-01), Funaki
patent: 4405436 (1983-09-01), Kobayashi et al.
patent: 4414086 (1983-11-01), Lamont
patent: 4486287 (1984-12-01), Fournier
patent: 4604180 (1986-08-01), Hirukawa et al.
patent: 4747926 (1988-05-01), Shimuzu
patent: 4933064 (1990-06-01), Geisler et al.

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