Sputtering apparatus of forming thin film

Details Sputtering apparatus of forming thin film Sputtering apparatus of forming thin film

2008-12-17

2010-06-29

McDonald, Rodney G (Department: 1795)

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

C204S192260, C204S298110, C204S298140, C204S298200, C204S298250

Reexamination Certificate

active

07744731

ABSTRACT:
A sputtering deposit apparatus capable of depositing a thin film having uniform sheet resistance value is provided. The sputtering deposit apparatus is arranged with at least two magnetron sputtering units within a film deposit chamber. On the upstream side in the substrate transfer direction43of the target shield55provided on the magnetron sputtering unit disposed on the most upstream side in the substrate transfer direction, of at least the two magnetron sputtering units, there is disposed the first cathode shield62which is electrically insulated.

REFERENCES:
patent: 5833815 (1998-11-01), Kim et al.
patent: 2003/0089601 (2003-05-01), Ding et al.
patent: 63-103060 (1988-05-01), None
patent: 08-167479 (1996-06-01), None
patent: 09-272973 (1997-10-01), None
patent: 10/046334 (1998-02-01), None
patent: 11/246969 (1999-09-01), None
patent: 2000-345335 (2000-12-01), None
patent: 2002-146528 (2002-05-01), None
patent: 2002-220663 (2002-08-01), None
patent: 2005-510045 (2005-04-01), None

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