Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1991-12-06
1993-03-30
Nguyen, Nam X.
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
2041922, 20429823, 20429828, C23C 1434
Patent
active
051980908
ABSTRACT:
A sputtering apparatus for coating a substrate comprising a first electrode for supporting a target material and a second electrode for supporting a substrate, upon which the coating is deposited. A source of RF power is connected to impose an RF voltage across the electrodes to produce a glow discharge in the space between the electrodes, and shutter means is provided in the space between the electrodes. The shutter means has means for blocking a substantial part of the sputtered atoms from the target electrode glow discharge traveling at or near normal incidence and at least one opening shaped to permit a substantial part of the sputtered atoms from the target electrode traveling at an oblique angle to impinge upon the substrate to produce a thin film coating of the target material.
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patent: 4576699 (1986-03-01), Sato et al.
patent: 4808489 (1989-02-01), Abe et al.
patent: 4816127 (1989-03-01), Eltoukhy
Galicki Arkadi
Horng Cheng T.
Schwenker Robert O.
International Business Machines - Corporation
Nguyen Nam X.
Schmid, Jr. Otto
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