Sputtering apparatus and sputter film deposition method

Details Sputtering apparatus and sputter film deposition method Sputtering apparatus and sputter film deposition method

2005-03-08

2005-03-08

Versteeg, Steven (Department: 1753)

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

C204S298170, C204S298280, C204S298030, C204S298060, C204S298080

Reexamination Certificate

active

06863785

ABSTRACT:
A sputtering apparatus and a sputter film deposition method, which includes a conventional magnetron and an AC magnetron for deposition of a low refractive index film, and a conventional magnetron and an AC magnetron for deposition of a high refractive index film, performs film deposition by each of the AC magnetrons until having achieved 90% of a designed film thickness, and then performs the film deposition only by each of the conventional magnetrons, and which can control the film thickness with high precision and have excellent productivity.

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English translation of JP 7-109569.

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