Sputtering apparatus and method for manufacturing compound thin

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

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20429807, 20429808, 20429811, 20429819, C23C 1434

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active

060802847

ABSTRACT:
A compound thin film, conforming to the stoichiometry, can be obtained by a magnetron sputtering method employing a thin film manufacturing apparatus wherein the film forming portion of the vacuum chamber is separated from the sputtering portion of the vacuum chamber by a multi-apertured partition, whereby sputtered molecules are permitted to pass through the apertures of the partition while sputter gas ions are hindered from passing through the apertures of the partition. The composition of the resulting compound thin film conforms to the stoichiometry of its components.

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