Sputtering apparatus and method

Details Sputtering apparatus and method Sputtering apparatus and method

1994-12-06

1995-08-15

Weisstuch, Aaron

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20429807, 20429811, 20429825, 20429826, C23C 1434, C23C 1456

Patent

active

054416159

ABSTRACT:
The sputtering apparatus includes: at least one film-forming vacuum chamber in which a plurality of sputtering targets and a like plurality of box-shaped deposition-shield members are disposed, each deposition-shield surrounding the corresponding target in such a manner that each of the targets faces a corresponding substrate, each deposition-shield member having an opening which enables sputtered particles to travel from the target to the corresponding substrate.
The arrangement of the sputtering apparatus may be such that the substrate is supported by a holder and the substrate holder is placed facing the opening provided in a wall of the deposition-shield member, wherein the area of the substrate holder is larger than that of the opening of the deposition-shield member, and a part of the area of the substrate holder which faces the wall of the deposition-shield member overlaps a closed portion of the deposition-shield member when viewed in plan.

REFERENCES:
patent: 4851095 (1989-07-01), Scobey et al.
patent: 4981566 (1991-01-01), Wurczinger
patent: 5229194 (1993-07-01), Lingle et al.
patent: 5364481 (1994-11-01), Sasaki et al.

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