Sputtering apparatus

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

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Details

204192R, 204192M, C23C 1500

Patent

active

044054360

ABSTRACT:
In a sputtering apparatus of the type wherein a cathode including a target made of ferromagnetic material and a substrate to be sputtered are disposed in an evacuated vessel in a spaced opposing relationship so as to sputter the target with ions to form thin magnetic films on said substrate, there are provided a magnet disposed on a backing plate, a shield covering surfaces of the magnet facing the substrate, the shield being made of the same or similar material as the target, and a metal block disposed to surround the magnet in contact with the shield and the backing plate. A passage for passing cooling water to cool the above components is further provided in the cathode.

REFERENCES:
patent: 3117065 (1964-01-01), Wootten
patent: 3838031 (1974-09-01), Snaper
patent: 3840451 (1974-10-01), Golyanov et al.
patent: 4282083 (1981-08-01), Kertesz et al.
patent: 4299678 (1981-11-01), Meckel
patent: 4324631 (1982-04-01), Meckel et al.
patent: 4370217 (1983-01-01), Funaki

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