Sputtering apparatus

Details Sputtering apparatus Sputtering apparatus

2007-06-12

2007-06-12

McDonald, Rodney G. (Department: 1753)

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

C204S192110, C204S298040, C204S298110, C204S298230, C204S298270, C204S298280, C204S298290

Reexamination Certificate

active

10795315

ABSTRACT:
A sputtering apparatus for forming a film by a physical gas-phase growth on a substrate having a irregular or flat shape is provided including three or more axes for independently varying a relative positional relationship between a substrate and a cathode in the course of film formation.

REFERENCES:
patent: 4664935 (1987-05-01), Strahl
patent: 6010600 (2000-01-01), Vernon et al.
patent: 6238531 (2001-05-01), Pinarbasi
patent: 63-266061 (1988-11-01), None
patent: 07-150347 (1995-06-01), None
patent: 09-040441 (1997-02-01), None
patent: 09-213634 (1997-08-01), None
patent: 10-30170 (1998-02-01), None
Machine Translation of Japanese 09-040441 dated Feb. 1997.

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