Sputter system incorporating an improved blocking shield for con

Details Sputter system incorporating an improved blocking shield for con Sputter system incorporating an improved blocking shield for con

1981-11-27

1983-11-22

Weisstuch, Aaron

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

204192R, 118720, 118721, 118504, 118505, C23C 1500

Patent

active

044167598

ABSTRACT:
The arbitrary contouring of thickness of a sputter-deposited film is made possible by a blocking means having a primary blocking shield and an ancillary blocking shield. The primary blocking shield intercepts atoms sputtered directly from the cathode target by line-of-sight transport. The ancillary blocking shield extends downwardly from the side of the primary blocking shield which is placed closest to the substrate. The ancillary blocking shield intercepts atoms sputtered from the cathode which by intervening gas collisions have been redirected to travel underneath the primary blocking shield. Precise tailoring of the thickness profile of the coating on the substrate is thereby provided and the quality of the composite film is maintained. The method for contouring the thickness of sputter coated layers comprises sputter coating portions of the film at successive stations. By employing the improved blocking shield at selected stations, the film in the aggregate may have the desired thickness contour.

REFERENCES:
patent: 3544790 (1970-12-01), Brown
patent: 3897324 (1975-07-01), Del Monte et al.

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