Sputter module for modular wafer processing system

Details Sputter module for modular wafer processing system Sputter module for modular wafer processing system

1986-04-28

1987-06-02

Williams, Howard S.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

C23C 1434, C23C 1456

Patent

active

046701265

ABSTRACT:
A machine for sputter deposition of a wafer workpiece also sputters on the wafer supporting mechanism. This causes a need for cleaning or replacement of the support mechanism. A sputter machine is provided in which the supporting mechanism can be isolated from the sputtering source, the pumps and other processing apparatus for cleaning without exposing the entire machine to atmosphere.

REFERENCES:
patent: 4313815 (1982-02-01), Graves, Jr. et al.
patent: 4379743 (1983-04-01), Nakatsukasa et al.
patent: 4405435 (1983-09-01), Tateishi et al.
patent: 4500407 (1985-02-01), Boys et al.
patent: 4548699 (1985-10-01), Hutchinson et al.
patent: 4584045 (1986-04-01), Richards

Affiliated with

Also associated with

Rating

Sputter module for modular wafer processing system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Sputter module for modular wafer processing system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sputter module for modular wafer processing system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-611620