Sputter deposition method for forming integrated circuit

Details Sputter deposition method for forming integrated circuit Sputter deposition method for forming integrated circuit

2006-06-23

2011-10-18

McDonald, Rodney (Department: 1724)

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

C204S298110, C204S298140, C204S298150, C204S298160, C204S298060, C204S192170

Reexamination Certificate

active

08038850

ABSTRACT:
A sputter deposition apparatus and method, and a substrate holder for use with a sputter deposition apparatus is disclosed. According to one embodiment of the invention, a sputter deposition apparatus is provided, including at least one sputter target, a first plasma, a substrate holder, and a further plasma. In one embodiment, the further plasma is an ECWR plasma. According to an additional embodiment of the invention, an anode is provided between the further plasma, and the substrate holder. According to a further embodiment, the substrate holder includes a dielectric layer with varying thickness.

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