Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Reexamination Certificate
2005-10-24
2009-08-25
McDonald, Rodney G (Department: 1795)
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
C204S298160, C204S298180, C204S298190, C204S298210, C204S298220, C204S298230
Reexamination Certificate
active
07578908
ABSTRACT:
A sputter coating system comprises a vacuum chamber, means for generating a vacuum in the vacuum chamber, a gas feed system attached to the vacuum chamber, a gas plasma forming system attached to the vacuum chamber, a system for confining and guiding a gas plasma within the vacuum chamber, and a prism-shaped sputter target assembly, with the material to be sputtered forming at least the outer surface of the target assembly and positioned such that the outer surface is surrounded by the plasma within the vacuum chamber. A negative polarity voltage is applied to the surface of the material such that sputtering occurs.
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Hockley Peter J.
Thwaites Michael
McDonald Rodney G
Nixon & Vanderhye PC
Plasma Quest Limited
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