Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Reexamination Certificate
2005-05-31
2005-05-31
Cantelmo, Gregg (Department: 1745)
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
C204S298160, C204S298230
Reexamination Certificate
active
06899795
ABSTRACT:
A sputtering chamber system and method uses at least one sputtering source with a new sputter surface at least approximately symmetrical with respect to a central axis. A substrate carrier is arranged to be drivingly rotatable about a substrate carrier axis. The central axis and the substrate carrier axis are oblique with respect to one another, and the sputtering source is a magnetron sputtering source. The new sputter surface is substantially rotationally symmetrical with respect to the central axis, with the central axis and the substrate carrier axis intersecting at least approximately. With respect to an angle β between the central axis and the substrate carrier axis,in-line-formulae description="In-line Formulae" end="lead"?30°≦β≦60°,in-line-formulae description="In-line Formulae" end="tail"?preferablyin-line-formulae description="In-line Formulae" end="lead"?40°≦β≦55°,in-line-formulae description="In-line Formulae" end="tail"?particularly preferablyin-line-formulae description="In-line Formulae" end="lead"?43°≦β≦50°,in-line-formulae description="In-line Formulae" end="tail"?particularlyin-line-formulae description="In-line Formulae" end="lead"?β≈45°.in-line-formulae description="In-line Formulae" end="tail"?
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Copy of Search Report.
Dubs Martin
Schertler Roman
Cantelmo Gregg
Crowell & Moring LLP
Unaxis Balzers Aktiengesellschaft
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