Spray cooling thermal management system and method for...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C165S080400

Reexamination Certificate

active

07102374

ABSTRACT:
A micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes micro-spray heads disposed about a probe head. The spray heads and probe head are disposed in a sealed manner inside a spray chamber that, during operation, is urged in a sealing manner onto a sealing plate holding the integrated circuit under test. The atomized mist cools the integrated circuit and then condenses on the spray chamber wall. The condensed fluid is pumped out of the chamber and is circulated in a chiller, so as to be re-circulated and injected again into the micro-spray heads. The pressure inside the spray chamber may be controlled to provide a desired boiling point.

REFERENCES:
patent: 5220804 (1993-06-01), Tilton et al.
patent: 5285351 (1994-02-01), Ikeda
patent: 5349831 (1994-09-01), Daikoku et al.
patent: 5361032 (1994-11-01), Waterbly
patent: 5515910 (1996-05-01), Hamilton et al.
patent: 5579826 (1996-12-01), Hamilton
patent: 6498725 (2002-12-01), Cole et al.
patent: 6621275 (2003-09-01), Cotton et al.
patent: 05166912 (1993-07-01), None
Backside Silicon Integrated Circuit Infrared Immersion Lens/Heat Sink; IBM Technical Disclosure Bulletin; vol. 35, No. 7, Dec. 1992; ISSN 0018-8689.

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