Spotter-deposit method and apparatus

Details Spotter-deposit method and apparatus Spotter-deposit method and apparatus

1996-07-23

1998-04-21

Weisstuch, Aaron

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20419212, 20419215, 20429808, 20429809, 20429825, 20429826, C23C 1434, C23C 1454, C23C 1456

Patent

active

057414050

ABSTRACT:
A method and apparatus for sputter-depositing a layer of a material on a substrate, in which the layer is applied to the substrate by sequentially effecting a plurality of partial sputter-deposits thereon during a plurality of operational periods each including a sputter-deposit time interval followed by a non-deposit time interval of at least equal duration to the sputter-deposit time interval.

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patent: 4705592 (1987-11-01), Bahrle et al.
patent: 4812217 (1989-03-01), George et al.
patent: 4891009 (1990-01-01), Pivit et al.
patent: 4902394 (1990-02-01), Kenmotsu et al.
patent: 5284548 (1994-02-01), Carey et al.
patent: 5300205 (1994-04-01), Fritsche
patent: 5500102 (1996-03-01), Ichikawa et al.
patent: 5510011 (1996-04-01), Okamura et al.

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