Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2008-03-18
2008-03-18
Gushi, Ross (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
11647026
ABSTRACT:
A split microprocessor socket is disclosed that provides a cavity created at an outer edge of the microprocessor socket. An optical module may be fitted in the cavity thus providing an optical fiber or waveguide connection directly to the socket. This low cost optical interconnect, closely packaged with the microprocessor, may alleviate bandwidth constraints associated with conventional electrical connections.
REFERENCES:
patent: 6325552 (2001-12-01), Brillhart
patent: 6347946 (2002-02-01), Trobough et al.
patent: 6592269 (2003-07-01), Brophy et al.
patent: 6637949 (2003-10-01), Loch et al.
patent: 6815729 (2004-11-01), Brophy et al.
patent: 6887109 (2005-05-01), Hofmeister et al.
patent: 6945712 (2005-09-01), Conn
patent: 6955481 (2005-10-01), Colgan et al.
patent: 7008238 (2006-03-01), Hofmeister et al.
patent: 7084496 (2006-08-01), Benner et al.
patent: 7168863 (2007-01-01), Yajima
patent: 7195401 (2007-03-01), Moll et al.
patent: 2001/0000763 (2001-05-01), Muramatsu
patent: 2005/0058408 (2005-03-01), Colgan et al.
patent: 2005/0064743 (2005-03-01), Hofmeister et al.
patent: 2005/0286239 (2005-12-01), Trobough
patent: 2005/0287837 (2005-12-01), Trobough
patent: 2006/0078248 (2006-04-01), Sasaki et al.
patent: 2006/0105607 (2006-05-01), Hougham et al.
patent: 2006/0159405 (2006-07-01), Yajima
patent: 2006/0182397 (2006-08-01), Benner et al.
patent: 2006/0291784 (2006-12-01), Wang et al.
Henning Braunisch et al., Flex-Circuit Chip-to-Chip Interconnects, 2006 Electronic Components and Technology Conference, 2006 IEEE, pp. 1853-1859.
Alduino Andrew C.
Braunisch Henning
Lu Daoqiang
Gushi Ross
Intel Corporation
Reif Kevin A.
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