Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Reexamination Certificate
2005-09-02
2009-11-17
Nguyen, Nam X (Department: 1795)
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
C204S298170, C204S298200, C204S298130
Reexamination Certificate
active
07618521
ABSTRACT:
A split magnet ring, particularly useful in a magnetron plasma reactor sputter depositing tantalum or tungsten or other barrier metal into a via and also resputter etching the deposited material from the bottom of the via onto the via sidewalls. The magnet ring includes two annular magnet rings composed of the same axial polarity separated by a non-magnetic spacing of at least the axial length of one magnet and associated poles. A small unbalanced magnetrons rotates about the back of the target having an outer pole of the same polarity as the ring magnets surrounding a weaker inner pole of the opposite pole.
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patent: 2004/0094509 (2004-05-01), Miyata et al.
Applied Materials Inc.
Berman Jason M
Law Offices of Charles Guenzer
Nguyen Nam X
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