Split gate memory cell in a FinFET

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S619000, C257S314000, C257SE29264

Reexamination Certificate

active

07544980

ABSTRACT:
A memory cell is implemented using a semiconductor fin in which the channel region is along a sidewall of the fin between source and drains regions. One portion of the channel region has a select gate adjacent to it and another other portion has the control gate adjacent to it with a charge storage structure there between. In some embodiments, independent control gate structures are located adjacent opposite sidewalls of the fin so as to implement two memory cells.

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patent: 2004/0235300 (2004-11-01), Mathew et al.
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patent: 2005/0280103 (2005-12-01), Langdo et al.
PCT International Search Report and Written Opinion regarding International Application No. PCT/US 06/62281, Applicant's file reference SC14944TP, mailed Feb. 14, 2008.

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