Split and merge design flow concept for fast turnaround time...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C716S030000, C716S030000, C716S030000, C716S030000

Reexamination Certificate

active

06898770

ABSTRACT:
A method and system is disclosed to improve the turnaround time to provide adequate time to meet project schedules in the event that adjustments or modifications to the design are necessary. A method for improving a turnaround time for design verification of a process database representing a semiconductor design includes the steps of (a) deriving a timing database and a (DNE) database from the process database; (b) performing, using the timing database, one or more design changes and one or more timing verifications and corrections to generate a modified timing database; (c) initiating, using the process database, physical validation of the semiconductor design prior to completion of step (b) to generate a modified DNE database; (d) merging the modified timing database with the modified DNE database to form a modified process database; and (e) performing, using the modified process database, one or more design verification checks of the semiconductor design.

REFERENCES:
patent: 6701289 (2004-03-01), Garnett et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Split and merge design flow concept for fast turnaround time... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Split and merge design flow concept for fast turnaround time..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Split and merge design flow concept for fast turnaround time... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3429267

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.