Spindle assembly for force controlled polishing

Details Spindle assembly for force controlled polishing Spindle assembly for force controlled polishing

1999-08-30

2000-07-04

Scherbel, David A.

Abrading

Precision device or process - or with condition responsive...

Computer controlled

451 8, 451 9, 451 11, 451 41, 451 63, B24B 4900

Patent

active

060830824

ABSTRACT:
A spindle assembly for force controlled operation in applications such as the chemical mechanical planarization of semiconductor wafers includes an axially and rotatably movable spindle driven by a force producing device. The force producing device is controlled by a position feedback loop in a first mode of operation and a spindle force control feedback loop in a second mode of operation so that the same force producing device controls spindle movement in the first mode of operation and maintains a constant pressure on a workpiece based on the detected applied pressure in the second mode of operation.

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U.S. application No. 08/968,333, filed Nov. 12, 1997.

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