Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With workpiece support
Reexamination Certificate
2007-11-27
2011-10-18
MacArthur, Sylvia R. (Department: 1716)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With workpiece support
C118S730000
Reexamination Certificate
active
08038838
ABSTRACT:
A spin head includes chucking pins configures to chuck and unchuck a substrate. Contact portions of the chucking pins and the substrate are varied during a process to prevent a treating solution from remaining at the contact portions.
REFERENCES:
patent: 5989342 (1999-11-01), Ikeda et al.
patent: 7018555 (2006-03-01), Shimbara et al.
patent: 2002/0027138 (2002-03-01), Hyobu
patent: 2008/0052948 (2008-03-01), Kim et al.
patent: 2008/0127888 (2008-06-01), Kim et al.
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Note: The four (4) Japanese references were cited in a first Office Action issued Apr. 20, 2010 in the corresponding Japanese patent application.
Cho Jung Keun
Choi Jung Bong
Choi Ki Hoon
Kim Ju Won
Koo Kyo Woog
Charter IP LLC
Lattig Matthew J.
MacArthur Sylvia R.
Semes Co. Ltd.
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