Solvent prewet and method to dispense the solvent prewet

Details Solvent prewet and method to dispense the solvent prewet Solvent prewet and method to dispense the solvent prewet

1997-11-19

2000-11-14

Beck, Shrive

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

427240, 427301, 427299, 427346, H01L 2131, B05D 312, B05D 310

Patent

active

061470104

ABSTRACT:
A method and apparatus is provided for more efficiently application of photoresist to a wafer surface. One aspect of the method comprises applying solvent to the wafer and spinning it to coat the entire wafer surface prior to the application of photoresist. This reduces surface tension on the wafer and reduces the amount of resist required to achieve a high quality film. The apparatus comprises adding a third solenoid and nozzle to the coating to accommodate the application of solvent tot he center of the wafer surface. The method also describes incorporating a new solvent comprising DI-Acetone Alcohol, which is a low-pressure solvent, providing extended process latitudes and reduced material expenditures.

REFERENCES:
patent: 3950184 (1976-04-01), Adams et al.
patent: 4190015 (1980-02-01), Hillman
patent: 4393807 (1983-07-01), Fujimura et al.
patent: 4518678 (1985-05-01), Allen
patent: 4996080 (1991-02-01), Daraktchiev
patent: 5066616 (1991-11-01), Gordon
patent: 5366757 (1994-11-01), Lin
patent: 5378511 (1995-01-01), Cardinali et al.
patent: 5411836 (1995-05-01), Yoda et al.
patent: 5658615 (1997-08-01), Hasebe et al.

Affiliated with

Also associated with

Rating

Solvent prewet and method to dispense the solvent prewet does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solvent prewet and method to dispense the solvent prewet, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solvent prewet and method to dispense the solvent prewet will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2065069