Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2007-01-02
2007-01-02
Lee, Sin (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S914000, C430S905000, C430S326000, C430S311000, C430S921000, C430S919000, C430S925000, C528S351000, C528S353000, C528S319000, C525S928000
Reexamination Certificate
active
10702741
ABSTRACT:
A soluble polyimide for a photosensitive polyimide precursor and a photosensitive polyimide precursor composition including the soluble polyimide, wherein the soluble polyimide contains hydroxyl and acetyl moieties and at least one reactive end-cap group at one or both ends of the polymer chain. The photosensitive polyimide precursor composition comprises the soluble polyimide, a polyamic acid containing at least one reactive end-cap group at one or both ends of the polymer chain, a photo acid generator (PAG) and optionally a dissolution inhibitor. Since the polyimide film of the present invention exhibits excellent thermal, electric and mechanical properties, it can be used as insulating films or protective films for various electronic devices. A pattern with a high resolution may be formed even on the polyamide film having a thickness of above 10 μm.
REFERENCES:
patent: 3957512 (1976-05-01), Kleeberg et al.
patent: 4093461 (1978-06-01), Loprest et al.
patent: 4243743 (1981-01-01), Hiramoto et al.
patent: 4880722 (1989-11-01), Moreau et al.
patent: 4927736 (1990-05-01), Mueller et al.
patent: 4942108 (1990-07-01), Moreau et al.
patent: 6541178 (2003-04-01), Jung et al.
patent: 2002/0093077 (2002-07-01), Jung et al.
patent: 2004/0029045 (2004-02-01), Nunomura et al.
patent: 60-37550 (1985-02-01), None
patent: 62-135824 (1987-06-01), None
patent: 64-60630 (1989-03-01), None
patent: 7-33874 (1995-02-01), None
patent: 7-134414 (1995-05-01), None
patent: 52-13315 (1997-02-01), None
Jung Myung Sup
Jung Sung Kyung
Park Yong Young
Yang Sang Yoon
LandOfFree
Soluble polyimide for photosensitive polyimide precursor and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Soluble polyimide for photosensitive polyimide precursor and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Soluble polyimide for photosensitive polyimide precursor and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3751052