Solid tape automated bonding packaging method

Details Solid tape automated bonding packaging method Solid tape automated bonding packaging method

1997-05-15

1998-06-09

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438123, H01L 2160

Patent

active

057632944

ABSTRACT:
A solid tape automated bonding method includes steps of: applying a pattern of a first dry film on a first portion of a copper plate; forming wiring; forming bumps; removing dry film and exposing the wiring and the bumps; selectively laminating an insulator layer onto portions of the exposed copper plate and the wiring; laminating a metal layer on the insulator layer; applying glue on the metal layer, the bumps, and respective exposed portions of the wiring and the copper plate; etching the copper plate thus exposing one side of the wiring as ball pads and exposing one side of the insulator layer; coating solder resist on the exposed bottom side of the insulator layer; removing the glue; attaching a die against the bumps; applying mold compound onto the die so as to fix the die in place; and attaching solder balls onto the ball pads. This method provides relatively high density of wiring and simplification in manufacturing.

REFERENCES:
patent: 4411719 (1983-10-01), Lindberg
patent: 5212402 (1993-05-01), Higgins, III
patent: 5474957 (1995-12-01), Urushima
patent: 5518957 (1996-05-01), Kim
patent: 5556907 (1996-09-01), Bhattacharyya et al.
patent: 5661086 (1997-08-01), Nakashima et al.

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