Solid state silicon-based condenser microphone

Details Solid state silicon-based condenser microphone Solid state silicon-based condenser microphone

1998-10-30

2000-07-11

Kuntz, Curtis A.

Electrical audio signal processing systems and devices

Electro-acoustic audio transducer

Microphone capsule only

381175, 381191, 367181, 367174, H04R 2500

Patent

active

060884630

ABSTRACT:
A solid state silicon-based condenser microphone comprising a silicon transducer chip (1). The transducer chip includes a backplate (13) and a diaphragm (12) arranged substantially parallel to each other with a small air gap in between, thereby forming an electrical capacitor. The diaphragm (12) is movable relative to the backplate (13) in response to incident sound. An integrated electronic circuit chip (3) or ASIC is electrically coupled to the transducer chip (1). An intermediate layer (2) fixes the transducer chip (1) to the integrated electronic circuit chip (3) with the transducer chip (1) on a first side of the intermediate layer (2) and the integrated electronic circuit chip (3) on a second side of the intermediate layer (2) opposite the first side. The intermediate layer (2) has a sound inlet (4) on the same side as the ASIC giving access of sound to the diaphragm.

REFERENCES:
patent: 4922471 (1990-05-01), Kuehnel
patent: 5146435 (1992-09-01), Bernstein
patent: 5452268 (1995-09-01), Bernstein
patent: 5490220 (1990-05-01), Leoppert
patent: 5531787 (1996-07-01), Lesinski et al.
patent: 5573679 (1996-11-01), Mitchell et al.
patent: 5659195 (1997-08-01), Kaiser et al.
patent: 5677965 (1997-10-01), Moret et al.

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