Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Reexamination Certificate
2006-02-14
2006-02-14
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
Reexamination Certificate
active
06998281
ABSTRACT:
A light emitting device containing an array of directional emission LEDs is provided. The directional emission LEDs of the array may be substrate emitting, lateral current injection, resonant cavity LEDs mounted in a flip-chip configuration. Each LED may emit a different color of light, such that the output of the array appears white to an observer. The LED array package may contain microoptical elements, such as a diffraction grating or microprisms, integrated into the light emitting surface of the package. The microoptical elements are used to mix the light beams emitted by individual LEDs in the array.
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Krishnamurthy Vikram Bidare
Taskar Nikhil Ramesh
Dolan Jennifer M.
General Electric Company
Jr. Carl Whitehead
Yoder Fletcher
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