Solid-state imaging device with molded resin ribs and method...

Details Solid-state imaging device with molded resin ribs and method... Solid-state imaging device with molded resin ribs and method...

2007-04-10

2007-04-10

Luu, Thanh X. (Department: 2878)

Radiant energy

Photocells; circuits and apparatus

Housings

C257S434000, C438S065000

Reexamination Certificate

active

10970533

ABSTRACT:
A solid-state imaging device includes a wiring board composed of an insulating resin, frame-shaped ribs arranged on the wiring board, a transparent plate arranged on an upper surface of the ribs, a plurality of wiring members that electrically lead from an internal space of a case formed by the wiring board and the ribs to the outside, an imaging element fixed on the wiring board within the internal space, and connecting members which connect electrodes of the imaging element and the wiring members. The ribs are formed by resin molding directly onto a face of the transparent plate, and a lower surface of the ribs is fixed to the wiring board with an adhesive. The package is configured without adhesive interposed between the ribs and the transparent sealing plate, thereby reducing the effect on incident light.

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patent: 2002-373950 (2002-12-01), None
Korean Office Action for the corresponding Korean application: 10-2004-0084418, mailed Nov. 30, 2006.

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