Solid state imaging device having a solid state image sensor and

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

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Details

257676, 257680, 257723, 257787, H01L 310232, H01L 2328, H01L 23495

Patent

active

055236081

ABSTRACT:
A peripheral IC 6 for a solid state imaging device is mounted on an island 7 of a lead frame and thereafter covered and sealed by a molding resin, thus forming a premolded package 2. Subsequently, a solid state image sensor 1 is mounted on the island 7 on one side thereof facing an opening. Thereafter, for protection of the solid state image sensor 1, a transparent lid 11 is attached to the premolded package 2 by adhesive. As a result, packaging area can be reduced in mounting the solid state image sensor on a packaging substrate, allowing video equipment such as video cameras to be miniaturized.

REFERENCES:
patent: 4663833 (1987-05-01), Tanaka et al.
patent: 4894707 (1990-01-01), Yamawaki et al.
patent: 5079190 (1992-01-01), Mihara
patent: 5220198 (1993-06-01), Tsuji

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