Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2001-01-22
2002-10-29
Lee, Eddie (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S738000, C257S668000, C257S433000
Reexamination Certificate
active
06472761
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to a solid-state image pickup apparatus which adopts a face-down packaging (face-down bonding) so as to mount a solid-state image pickup device, and to a manufacturing method thereof.
BACKGROUND OF THE INVENTION
Conventionally, as shown in
FIG. 13
, a solid-state image pickup apparatus
100
has a structure in which a solid-state image pickup device
102
is fixed to a package
101
, and the solid-state image pickup device
102
and the package
101
are connected by wiring, using Au wires
103
, and a light receiving portion of the solid-state image pickup device
102
is sealed with a transparent substrate
104
of glass, optical filter and the like. This structure is generally called a “wire bonding structure”.
However, in order to prevent a short-circuit defect on the Au wires
103
for connecting an electrode terminal
105
of the package
101
with an electrode terminal
106
of the solid-state image pickup device
102
, it is required that the solid-state image pickup apparatus
100
of the wire bonding structure provides a wire loop so that it has a space in a direction of height, and the adjacent electrode terminals
105
of the package
101
have a wide pitch therebetween, thus being difficult to attain a compact and thin solid-state image pickup apparatus. Since there is a limit in attaining a compact and thin solid-state image pickup apparatus by the solid-state image pickup apparatus
100
having the foregoing structure, a solid-state image pickup apparatus disclosed, for example, in Japanese Unexamined Patent Publication No. 204442/1994 (Tokukaihei 6-204442 published on Jul. 22, 1994) adopts the following structure. That is, as shown in
FIG. 14
, a solid-state image pickup apparatus
110
adopts face-down packaging for mounting a solid-state image pickup device
112
by making a surface thereof face a surface of a transparent substrate
111
so as to directly equip the transparent substrate
111
with the solid-state image pickup device
112
, thereby attempting to realize a compact and thin solid-state image pickup apparatus.
Thus, the conventional solid-state image pickup apparatus
110
including the solid-state image pickup device
112
on the transparent substrate
111
by direct face-down packaging has a great advantage in realizing a compact and thin solid-state image pickup apparatus. However, electric signal external input/output (I/O) terminals
113
on the transparent substrate
111
are disposed to point a side of light receiving surface of the solid-state image pickup device
112
, and therefore, the conventional solid-state image pickup apparatus
110
has such a problem that a highly developed assembly technique is required so as to integrate the solid-state image pickup apparatus
110
into peripheral devices.
Namely, the solid-state image pickup apparatus
110
, though miniaturized and thin, is so small that its workability is poor. Therefore, it is necessary to utilize a large-scale apparatus so as to allow thus small mounting component to be recognized as an equipment, and determine a mounting position, etc. This, as a result, raises such problems as to require higher development or complication of, and an increase in the cost of, an apparatus for mounting. More specifically, under such circumstances as above, in order to assemble components into an apparatus, it is necessary either to increase the manpower or to automate the assembly.
However, in fact, increasing the manpower is difficult, and the automation of the assembly requires large-scale devices such as a position recognizing device. That is, adopting either of the above means results in a problem of a large increase in costs.
Meanwhile, generally, a solid-state image pickup device is different from a normal semiconductor device in terms of dealing with an optical signal, i.e., an image. Moreover, on a surface of the solid-state image pickup device is formed organic components such as a color filter and a micro lens. Consequently, it is preferable that the surface of the solid-state image pickup device be hermetically sealed so as to prevent dusts, etc. In addition, most careful attention should be paid in the manufacturing steps of bonding and mounting assembly.
Therefore, during these manufacturing steps, it is required to prevent dusts and blemishes, and a bump or resin from being pressed out to a light receiving portion.
In this respect, the conventional solid-state image pickup apparatus
110
shown in
FIG. 14
has the following problems with regard to the bonding of projecting electrodes
114
, resin setting at the time of face-down packaging of the solid-state image pickup device
112
, dust disposing process at the time of face-down packaging.
First, when bonding the projecting electrodes
114
, as shown in
FIG. 14
, at the time of the face-down packaging of the solid-state image pickup device
112
, a conductive adhesive
116
is used to join the projecting electrodes
114
of the solid-state image pickup device
112
to an inner wiring metal layer
115
of the transparent substrate
111
. In that case, the conductive adhesive
116
is applied in a state of dots to the projecting electrodes
114
. This raises a problem of complication of the manufacturing step of bonding the projecting electrodes
114
.
Meanwhile, as to the setting of resin at the time of face-down packaging of the solid-state image pickup device
112
, projecting frame resins
118
which are different from seal resin
117
are arranged to remain inside of the projecting electrodes
114
without being set. When the seal resin
117
is applied for sealing in the following step, the projecting frame resins
118
play a role as a stopper which prevents the seal resin
117
from being pressed out. Further, in the solid-state image pickup apparatus
110
, the conductive adhesive
116
and the projecting frame resins
118
are set by an application of heat simultaneously with the setting of the seal resin
117
. For this reason, there arises problems such as the complication of, and an increase in, manufacturing processes at the time of face-down packaging.
Next, as to a problem of dusts at the time of face-down packaging, in the solid-state image pickup apparatus
110
, a surface of the solid-state image pickup device
112
is hermetically sealed simultaneously with the face-down packaging.
Accordingly, in addition to a problem of a high probability of adhesion of dusts due to many steps of applying a resin, the adhered dusts cannot easily be removed. Further, since the resins are not yet set, there is such a problem that they are pressed out with respect to the inside of the light receiving surface.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide a solid-state image pickup apparatus capable of reducing man-hours in bonding, improving bonding quality, and being readily integrated into peripheral devices, and a manufacturing method of the solid-state image pickup apparatus.
In order to attain the foregoing object, the solid-state image pickup apparatus according to the present invention includes: a transparent substrate having an inner wiring metal layer and an electrode terminal group for outputting an electric signal to the outside; a solid-state image pickup device in which each first projecting electrode corresponding to the inner wiring metal layer of the transparent substrate is formed on each surface electrode; and a print board of non-pin type lead terminal structure including an aperture which is as large as the solid-state image pickup device, wherein: the transparent substrate includes second projecting electrodes which are respectively formed on electrode terminals of the electrode terminal group, the transparent substrate and the solid-state image pickup device are bonded by face-down packaging, and the inner wiring metal layer of the transparent substrate and the each first projecting electrode of the solid-state image pickup device are connected by ultrasonic bonding, and the transparent substrate and the print board
Conlin David G.
Dike, Bronstein, Roberts & Cushman IP Group, Edwards & Angell, L
Hartnell, III George W.
Lee Eddie
Nguyen Joseph
LandOfFree
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