Solid state chip insertion apparatus

Elongated-member-driving apparatus – With means to move or guide member into driving position – Including means other than the driver to separate leading...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

B27F 708

Patent

active

040157644

ABSTRACT:
The present invention relates to semi-automatic apparatus for aligning and inserting a solid state electrical circuit chip or solid state chip receiving socket assembly into a printed circuit board or panel and automatically clinching a portion of the leads thereof so as to retain the chip and/or socket against accidental dislodgement from the circuit board prior to dip or wave soldering of the board.

REFERENCES:
patent: 792017 (1905-06-01), Fraser
patent: 2902689 (1959-09-01), Petersen
patent: 2928093 (1960-03-01), Bergsland et al.
patent: 3069688 (1962-12-01), Heil
patent: 3209623 (1965-10-01), Schardt
patent: 3442430 (1969-05-01), Ackerman et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Solid state chip insertion apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solid state chip insertion apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solid state chip insertion apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2262862

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.