Solid element device and method for manufacturing the same

Details Solid element device and method for manufacturing the same Solid element device and method for manufacturing the same

2004-03-10

2010-11-02

Vu, David (Department: 2818)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C257SE21504

Reexamination Certificate

active

07824937

ABSTRACT:
A method for manufacturing a solid element device, which comprises providing a glass-containing Al2O3substrate (3) having a GaN based LED element (2) placed thereon, setting a P2O5—ZnO based low melting point glass in parallel with the substrate, and carrying out a press working at a temperature of 415° C. or higher under a pressure of 60 kgf in a nitrogen atmosphere. Under these conditions, the low melting point glass has a viscosity of 109poise, and is adhered via an oxide formed on the surface of the glass-containing Al2O3substrate (3). A solid element device manufactured by the above method can be manufactured through a glass sealing working at a low temperature and also has a highly reliable sealing structure.

REFERENCES:
patent: 2801375 (1957-07-01), Losco
patent: 3377522 (1968-04-01), Tsuji et al.
patent: 3596136 (1971-07-01), Fischer
patent: 3615319 (1971-10-01), Shonebarger
patent: 3723835 (1973-03-01), Davis et al.
patent: 4018613 (1977-04-01), Martin
patent: 4129692 (1978-12-01), King et al.
patent: 4174491 (1979-11-01), Nakamura et al.
patent: 4186023 (1980-01-01), Dumesnil et al.
patent: 4680617 (1987-07-01), Ross
patent: 4784872 (1988-11-01), Moeller et al.
patent: 5391523 (1995-02-01), Marlor
patent: 5476553 (1995-12-01), Hanoka et al.
patent: 5485037 (1996-01-01), Marrs
patent: 5607886 (1997-03-01), Onozawa
patent: 5641997 (1997-06-01), Ohta et al.
patent: 5665983 (1997-09-01), Nagano
patent: 5670797 (1997-09-01), Okazaki
patent: 5814533 (1998-09-01), Shakuda
patent: 5814837 (1998-09-01), Okazaki
patent: 5882949 (1999-03-01), Okazaki
patent: 5981945 (1999-11-01), Spaeth et al.
patent: 6028327 (2000-02-01), Mizoguchi et al.
patent: 6096155 (2000-08-01), Harden et al.
patent: 6340824 (2002-01-01), Komoto et al.
patent: 6417019 (2002-07-01), Mueller et al.
patent: 6482664 (2002-11-01), Lee et al.
patent: 6842503 (2005-01-01), Wildfeuer
patent: 6911678 (2005-06-01), Fujisawa et al.
patent: 2001/0000622 (2001-05-01), Reeh et al.
patent: 2001/0010449 (2001-08-01), Chiu et al.
patent: 2001/0026011 (2001-10-01), Roberts et al.
patent: 2001/0042865 (2001-11-01), Oshio et al.
patent: 2001/0045573 (2001-11-01), Waitl et al.
patent: 2002/0001881 (2002-01-01), Kosokabe
patent: 2002/0070449 (2002-06-01), Yagi et al.
patent: 2003/0013595 (2003-01-01), Uehara
patent: 2003/0050177 (2003-03-01), Uehara
patent: 2003/0122482 (2003-07-01), Yamanaka et al.
patent: 2003/0230751 (2003-12-01), Harada
patent: 2006/0012299 (2006-01-01), Suehiro et al.
patent: 195 44 980 (1996-06-01), None
patent: 0 078 658 (1983-05-01), None
patent: 0078658 (1983-05-01), None
patent: 1 163 258 (1969-09-01), None
patent: 48-29383 (1973-04-01), None
patent: 49-53387 (1974-05-01), None
patent: 49-31278 (1974-08-01), None
patent: 58-84134 (1983-05-01), None
patent: 59-191388 (1984-10-01), None
patent: 61-096780 (1986-05-01), None
patent: 61-96780 (1986-05-01), None
patent: 63-31557 (1988-03-01), None
patent: 63-67792 (1988-03-01), None
patent: 5-315652 (1993-11-01), None
patent: 05-343744 (1993-12-01), None
patent: 06-289321 (1994-10-01), None
patent: 07-099294 (1995-04-01), None
patent: 07-169994 (1995-07-01), None
patent: 8-102553 (1996-04-01), None
patent: 8-213660 (1996-08-01), None
patent: 9-283803 (1997-10-01), None
patent: 10-135492 (1998-05-01), None
patent: 10-190190 (1998-07-01), None
patent: 11-040848 (1999-02-01), None
patent: 11-116275 (1999-04-01), None
patent: 11-177129 (1999-07-01), None
patent: 11-204838 (1999-07-01), None
patent: 11251643 (1999-09-01), None
patent: 11-289098 (1999-10-01), None
patent: 11-307692 (1999-11-01), None
patent: 2000-223750 (2000-08-01), None
patent: 2000-233939 (2000-08-01), None
patent: 2000-239801 (2000-09-01), None
patent: 2000-340876 (2000-12-01), None
patent: 2001-015773 (2001-01-01), None
patent: 2001-097737 (2001-04-01), None
patent: 2001-098144 (2001-04-01), None
patent: 2001-98144 (2001-04-01), None
patent: 2001-217467 (2001-08-01), None
patent: 2002-009347 (2002-01-01), None
patent: 2002-055211 (2002-02-01), None
patent: 2002-94123 (2002-03-01), None
patent: 2002-094128 (2002-03-01), None
patent: 2002-134792 (2002-05-01), None
patent: 2002-134792 (2002-05-01), None
patent: 2002-134821 (2002-05-01), None
patent: 2002-348133 (2002-12-01), None
patent: 2002-374006 (2002-12-01), None
patent: 2003-8071 (2003-01-01), None
patent: 2003-008071 (2003-01-01), None
patent: 2003-20249 (2003-01-01), None
patent: 2003-34791 (2003-02-01), None
patent: 2003-54983 (2003-02-01), None
patent: 2003-133596 (2003-05-01), None
patent: 2003-347586 (2003-12-01), None
patent: 2004-071710 (2004-03-01), None
Archer, Inorganic and Organometallic Polymers, 2001, pp. 1-33.
Japanese Office Action dated Nov. 6, 2007 with partial English language translation.
Chinese Office Action dated Jul. 6, 2007, with English translation.
Notification of Reasons for Refusal dated Mar. 27, 2007 with partial English translation.
Japanese Office Action dated Sep. 18, 2007 with partial English language translation.
Japanese Office Action dated Sep. 18, 2007, with partial English language translation.
Chinese Office Action dated Mar. 13, 2009 with English-Language Translation.
Chinese Office Action dated Jul. 3, 2009 with an English language translation.
Japanese Office Action dated Mar. 27, 2007 with Partial Englisgh translation.
Japanese Office Action dated Mar. 11, 2008 with partial English language translation.
Japanese Office Action dated Feb. 20, 2007, with partial English translation.
Japanese Office Action dated Mar. 23, 2010 (with partial English translation).
Japanese Office Action dated Aug. 10, 2010 (with a partial English translation).
Supplementary European Search Report dated Aug. 20, 2010.

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