Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2006-09-26
2006-09-26
Stoner, Kiley S. (Department: 1725)
Metal fusion bonding
Process
Plural joints
C228S246000, C148S024000, C257S737000, C420S562000, C438S613000
Reexamination Certificate
active
07111771
ABSTRACT:
A doped tin-indium solder composition is disclosed. The doped tin-indium solder exhibits a retained fine-grain structure and superplasticity after significant thermal cycling and thermal and mechanical stresses experienced in a microelectronic package. A process of forming the doped tin-indium solder is also disclosed. A microelectronic package is also disclosed that uses the doped tin-indium solder composition. A method of assembling a microelectronic package is also disclosed. A computing system is also disclosed that includes the doped tin-indium solder.
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