Soldering method and apparatus for use in connecting electronic

Details Soldering method and apparatus for use in connecting electronic Soldering method and apparatus for use in connecting electronic

1994-05-02

1996-05-14

Heinrich, Samuel M.

Metal fusion bonding

Process

With pretreating other than heating or cooling of work part...

228102, 228 9, 228 42, B23K 120, B23K 308

Patent

active

055160310

ABSTRACT:
In order to remove oxide film and contamination film on members to be bonded by soldering and solder material therefor corresponding to variation of thickness thereof by sputter-etching in a fluxless bonding method and apparatus therefor, substance emitted from the solder material under sputter-etching using atom or ion is detected and determined whether it is from the solder material or from the oxide film thereon. The sputter-etching is controlled on the basis of the determination to remove the oxide film. Then, the members are aligned in oxidizing atmosphere and soldered in non-oxidizing atmosphere.

REFERENCES:
patent: 4379218 (1983-04-01), Grebe et al.
patent: 5188280 (1993-02-01), Nakao et al.
patent: 5226580 (1993-07-01), Hartle et al.

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