Soldering device

Details Soldering device Soldering device

1999-01-27

2000-10-03

Ryan, Patrick

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

22818021, B23K 0108, B23K 3100, B23K 3102

Patent

active

061260606

ABSTRACT:
A soldering device adaptable to dipping method for preventing neighboring leads (L) from being mixed in molten lead (Pb) even though spaces between leads (L) of parts mounted to a PCB substrate (P) are relatively narrow, the device having a lead tub where molten lead is filled up to an upper end thereof and maintained at a predetermined temperature, the device comprising a receiving plate disposed at an upper surface of the lead tub and formed with a receiving unit for soldered parts of PCB substrate to contact the molten lead, a fixing unit mounted at the receiving plate for the PCB substrate to be accommodated with, detached from and fixed to the receiving unit, and an elevation arranged to elevate the receiving plate horizontally and slantingly.

REFERENCES:
patent: 3941088 (1976-03-01), Ronafoldi et al.
patent: 4162034 (1979-07-01), Pavlas
patent: 4555054 (1985-11-01), Winter et al.
patent: 4684054 (1987-08-01), Iwasa et al.
patent: 4802617 (1989-02-01), Deambrosio
patent: 4921156 (1990-05-01), Hohnerlein
patent: 5370297 (1994-12-01), Ciniglio et al.

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