Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1997-01-20
1998-12-01
Ostrowski, David
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257722, 361710, 361719, H01L 2334
Patent
active
058443126
ABSTRACT:
A clip secures a heat sink having a slot with grooves on opposing sides thereof to a transistor. The frame has sides with a width therebetween which can be wedged into grooves on opposing sides of a slot in the heat sink. A portion of the frame is raised up between two parallel cuts in the frame. A transistor is wedged under the raised up portion. The clip has legs which are insertable into a printed circuit board for easy assembly of a heat sink, transistor, clip and printed circuit board.
REFERENCES:
patent: 3641474 (1972-02-01), Owens
patent: 3694703 (1972-09-01), Wilens et al.
patent: 4054901 (1977-10-01), Edwards et al.
patent: 4215361 (1980-07-01), McCarthy
patent: 4388967 (1983-06-01), Breese
patent: 4509839 (1985-04-01), Lavochkin
patent: 4544942 (1985-10-01), McCarthy
patent: 4605058 (1986-08-01), Wilens
patent: 4609040 (1986-09-01), Moore
patent: 4710852 (1987-12-01), Keen
patent: 4803545 (1989-02-01), Birkle
patent: 4884331 (1989-12-01), Hinshaw
patent: 4933746 (1990-06-01), King
patent: 5019942 (1991-05-01), Clemens
patent: 5031028 (1991-07-01), Galich et al.
patent: 5040096 (1991-08-01), Churchill et al.
patent: 5138524 (1992-08-01), Smithers
patent: 5309979 (1994-05-01), Brauer
patent: 5343362 (1994-08-01), Solberg
patent: 5373099 (1994-12-01), Boitard et al.
patent: 5381041 (1995-01-01), Harmon
patent: 5381305 (1995-01-01), Harmen et al.
patent: 5466970 (1995-11-01), Smithers
patent: 5587608 (1996-12-01), Meng
patent: 5611393 (1997-03-01), Vasconcelos et al.
Hinshaw Howard G.
Jordan William D.
Smithers Matthew
Ostrowski David
Thermalloy Inc.
LandOfFree
Solderable transistor clip and heat sink does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Solderable transistor clip and heat sink, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solderable transistor clip and heat sink will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2397907