Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1997-04-28
2000-01-18
Codd, Bernard
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
4302831, 4302851, 4302871, 4302881, 430325, 522100, 522107, G03C 516, G03C 174, C08F 250
Patent
active
060156511
ABSTRACT:
The photo-curable liquid solder resist ink composition of the present invention mainly comprises a photo-polymerizable resin having sufficient molecular weight and (meth)acryloyl groups which are imparted by both of introduction of (meth)acryloyl groups into a novolak-type epoxy resin having 4 or more of benzene nuclei and polymerization using a chain-extension agent. The composition is useful for a photo-curable type resist, since it can produce a coated film excellent in tack free characteristic and resolution, and can produce a cured film excellent in heat resistance, adhesiveness, and chemical resistance. In addition, by reacting with an acid anhydride, development with alkalis becomes possible.
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Translation of p. 5 Lower-Left col., Lines 5-16 of Japanese Unexamined Patent Publication No. 3-59022, Mar. 14, 1991.
English Translation of JP 5-179185, Hashimoto et al, Jul. 20, 1993.
Arakawa Motohiro
Awaji Toshio
Otsuki Nobuaki
Tanaka Hiromichi
Codd Bernard
Nippon Shokubai Co. , Ltd.
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