Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1987-12-18
1990-05-15
Bleutge, John C.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
522100, 522103, 525482, 525922, C08G 830, C08G 832, G03C 168
Patent
active
049257730
ABSTRACT:
A solder resist ink composition is disclosed which contains a photo-curable resin obtained by causing an unsaturated monocarboxylic acid to react with a cresolnovolak- or phenolnovolak-type epoxy resin, and causing a polybasic carboxylic anhydride to react with the resultant reaction product, a photo-curable resin obtained by causing an unsaturated monocarboxylic acid to react with a bisphenol A novolak- or cycloaliphatic oxirane novolak-type opoxy resin, and causing a polybasic carboxylic anhydride to react with the resultant reaction product, at least one photo-polymerizable compound selected from photo-polymerizable monomers, a photo-polymerization initiator, an organic solvent, and an inorganic filler. Also disclosed are two other solder resist ink compositions each having a different photo-curable component.
REFERENCES:
patent: 4101398 (1978-07-01), Hesse
patent: 4428807 (1984-01-01), Lee
Kohara Teiji
Miyamura Masataka
Nakaizumi Yuji
Takeda Kazuhiro
Wada Yuusuke
Bleutge John C.
Kabushiki Kaisha Toshiba
Koeckert Arthur H.
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