Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1988-11-10
1991-10-08
McCamish, Marion E.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
522100, 522103, 522 77, G03C 1725, G03C 173, C08F 246, C08J 328
Patent
active
050553780
ABSTRACT:
A solder resist composition contains a specified partially acrylated and/or methacrylated bisphenol A novolak epoxy resin component, and a specified partially acrylated and/or methacrylated cresol novolak and/or phenol novolak epoxy resin component. The composition further contain a photopolymerization initiator, a thermosetting agent, an inorganic filler, and an organic solvent. The composition may further include a silane or titanate coupling agent.
REFERENCES:
patent: 4816496 (1989-03-01), Wada et al.
patent: 4925773 (1990-05-01), Miyamura et al.
Miyamura Masataka
Nakagawa Toshiharu
Nakaizumi Yuji
Takeda Kazuhiro
Wada Yusuke
Chapman Mark A.
Kabushiki Kaisha Toshiba
McCamish Marion E.
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