Solder pot for wave soldering machine

Details Solder pot for wave soldering machine Solder pot for wave soldering machine

1985-12-03

1987-05-19

Ramsey, Kenneth J.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

228 561, 118410, B23K 306

Patent

active

046660771

ABSTRACT:
Automatic wave solder apparatus in which printed circuit boards are passed over a wave soldering section to apply solder to exposed metallic surfaces on the undersides of the surface of the board. A weir is attached to the exit side of a discharge nozzle for the solder wave which is spring loaded upwards for engagement with a stop member. The solder pot assembly may be lowered and swung out of a circuit board conveyor path for cleaning and both front plate and rear plate members on each side of the discharge nozzle are hinged so they can be raised for cleaning when the solder pot assembly is lowered. The stop member permits the discharge nozzle to be raised to different heights, but retains the spring loaded weir at the same height.

REFERENCES:
patent: 3119363 (1964-01-01), Rieben
patent: 3604611 (1971-09-01), Lamberty
patent: 3921888 (1975-11-01), Elliott et al.
patent: 4465014 (1984-08-01), Bajka et al.
patent: 4530457 (1985-07-01), Down
Kostiek et al., "Wave Solder Chimney", IBM Technical Disclosure Bulletin, vol. 22, No. 9, pp. 3984-3985, Feb. 1980.
Winther: Technical Devices Company for the New Solder Machine.

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