Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1991-08-05
1992-11-03
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
1566591, 156666, 156901, 2281801, 257737, 29827, B44C 122, C23F 100
Patent
active
051604094
ABSTRACT:
A method for forming a solder-bumped circuit trace on a planar dielectric substrate includes fabricating a trace having an intersection between linear section, depositing onto the trace a uniform thin plate of solder alloy and reflowing the solder alloy to form a bump at the intersection. More particularly, the trace comprises first and second linear sections that intersect at an angle between 45 degrees and 135 degrees and have widths preferably between 50 and 150 microns. The solder plate is deposited, preferably by electroplating, at a thickness between about 10 and 25 microns. Thereafter, when the trace is heated to melt the solder layer, the solder coalesces at the intersection to form the bump.
REFERENCES:
patent: 3871014 (1975-03-01), King et al.
patent: 3871015 (1975-03-01), Lin et al.
patent: 4545610 (1985-10-01), Lakritz et al.
patent: 4878611 (1989-11-01), Lovasco et al.
Metal Finishing, Guidebook and kDirectory published by Metals and Plastics Publication, Inc., (1987), pp. 280, 282, 284.
Beckenbaugh William M.
Cholewczynski Ken
Moore Kevin D.
Stafford John W.
Fekete Douglas D.
Motorola Inc.
Powell William A.
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