Solder paste printing apparatus and printing method

Details Solder paste printing apparatus and printing method Solder paste printing apparatus and printing method

2005-08-02

2005-08-02

Hirshfeld, Andrew H. (Department: 2854)

Printing

Stenciling

Traveling-inker machines

C101S129000, C101S114000

Reexamination Certificate

active

06923117

ABSTRACT:
When solder paste passes through a first gap located between a pressurizing member and a printing mask during solder paste printing, a pressure directed toward the printing mask is applied from the pressurizing member to the solder paste.

REFERENCES:
patent: 3620230 (1971-11-01), Foret
patent: 3796153 (1974-03-01), Jaffa
patent: 4887623 (1989-12-01), Sugiyama et al.
patent: 5027703 (1991-07-01), Hancy
patent: 5095816 (1992-03-01), Hasegawa et al.
patent: 5197384 (1993-03-01), Yawata et al.
patent: 5323700 (1994-06-01), Katsuyama et al.
patent: 5479854 (1996-01-01), Chikahisa et al.
patent: 5485781 (1996-01-01), Rovaris
patent: 5786029 (1998-07-01), Watanabe
patent: 5976269 (1999-11-01), Hamasaki et al.
patent: 6036787 (2000-03-01), Bennett et al.
patent: 6626106 (2003-09-01), Peckham et al.
patent: 0 838 979 (1998-04-01), None
patent: 7-237290 (1995-09-01), None
patent: 7-329276 (1995-12-01), None
patent: 10-24551 (1998-01-01), None
patent: 10-44370 (1998-02-01), None
patent: 10-193577 (1998-07-01), None
patent: 2850150 (1998-11-01), None
patent: 11-320823 (1999-11-01), None

Affiliated with

Also associated with

Rating

Solder paste printing apparatus and printing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder paste printing apparatus and printing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder paste printing apparatus and printing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3522458