Solder paste containment device

Details Solder paste containment device Solder paste containment device

1998-10-26

2000-10-31

Jones, Deborah

Stock material or miscellaneous articles

Composite

Of metal

428446, 4284735, 228 41, 228 563, B32B 1508, B23K 100

Patent

active

061399728

ABSTRACT:
The invention provides an improved donor substrate for the formation and transfer of solder bumps useful in IC packaging and related interconnect applications. The donor substrate is improved by shaping the solder paste containment region (cavity) so that during reflow, the solder bump is urged to protrude significantly above the surface of the donor substrate, enabling proximity transfer of the solder bump to a receiving substrate.

REFERENCES:
patent: 5162257 (1992-11-01), Yung
patent: 5217597 (1993-06-01), Moore
patent: 5307983 (1994-05-01), Dudderar et al.
patent: 5400950 (1995-03-01), Myers
patent: 5447264 (1995-09-01), Koopman et al.
patent: 5539153 (1996-07-01), Schwiebert et al.
patent: 5586715 (1996-12-01), Schwiebert et al.
patent: 5643831 (1997-07-01), Ochiai et al.
patent: 5672542 (1997-09-01), Schwiebert et al.
patent: 5762259 (1998-06-01), Hubacher et al.
patent: 5775569 (1998-07-01), Berger et al.
patent: 5880017 (1999-03-01), Schweibert et al.
patent: 5889326 (1999-03-01), Tanaka
patent: 6008071 (1999-12-01), Karasawa et al.

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