Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1978-10-24
1980-07-01
Mehr, Milton S.
Metal working
Method of mechanical manufacture
Assembling or joining
228 56, 206329, 206486, B23P 1102
Patent
active
042098939
ABSTRACT:
A solder pack consists of a thin heat resistant carrier board having spaced holes therethrough in which are held solder rings. The solder pack is, for example, placed over pins supported in correspondingly spaced holes in a printed circuit board so that each pin protrudes through an associated solder ring in the solder pack. Heat is applied to melt the solder rings to solder the pins to the printed circuit board. Two representative means for manufacturing solder packs are disclosed.
REFERENCES:
patent: 3396894 (1966-08-01), Ellis
patent: 3472365 (1969-10-01), Tiedema
patent: 3744129 (1973-07-01), Dewey, Jr.
patent: 4099615 (1978-07-01), Lemke et al.
patent: 4142286 (1979-03-01), Knuth et al.
Buczak Ronald F.
Dyce John W.
Christoforo William G.
Eifler Raymond J.
Lacina C. Dennis
Mehr Milton S.
Ramsey K. J.
LandOfFree
Solder pack and method of manufacture thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Solder pack and method of manufacture thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder pack and method of manufacture thereof will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-293694