Solder mass having conductive encapsulating arrangement

Details Solder mass having conductive encapsulating arrangement Solder mass having conductive encapsulating arrangement

1990-06-19

1992-07-14

Hille, Rolf

357 68, 357 71, H01L 2348, H01L 2350, H01L 2354

Patent

active

051307790

ABSTRACT:
The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder mass is deposited and capped with a metal layer, thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a sidewall spacer formed on the sidewalls of the solder mass.

REFERENCES:
patent: 3496428 (1970-02-01), Volder
patent: 3512051 (1970-05-01), Noll
patent: 3761309 (1973-09-01), Schmitter et al.
patent: 3809625 (1974-05-01), Brown et al.
patent: 3821785 (1974-06-01), Rose
patent: 3986255 (1976-10-01), Mandal
patent: 4545610 (1970-02-01), Miller et al.
patent: 4626479 (1986-12-01), Hosoi et al.
patent: 4664309 (1987-05-01), Allen
patent: 4673772 (1987-06-01), Satoh et al.
patent: 4739917 (1988-04-01), Baker
patent: 4783722 (1988-11-01), Osaki et al.
Herdzik, et al, IBM Technical Disclosure Bulletin, vol. 21, No. 12, p. 4834 (May 1979).
N. Matsui, et al., "VLSI Chip Interconnection Technology Using Stacked Solder Bumps," IEEE Proceedings of 37th Electronic Components Conference, pp. 573-578, May 11-13, 1987.
"Small, Thick Solder Pad Formation" IBM Technical Disclosure Bulletin, vol. 27, No. 12, May 1985.

Affiliated with

Also associated with

Rating

Solder mass having conductive encapsulating arrangement does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder mass having conductive encapsulating arrangement, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder mass having conductive encapsulating arrangement will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-339265