Solder mask system

Details Solder mask system Solder mask system

1996-01-16

1998-08-04

Hamilton, Cynthia

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

G03F 740, H05K 334

Patent

active

057891427

ABSTRACT:
A masking method employing a photodefinable resin as a permanent dielectric mask, in which the resin contains a catalytic filler that when activated enables direct electroless plating of the resin. The resin serves to simplify selective electroplating of isolated surface features such as metal pads, while also improving the topology of the external surface of the circuit board, particularly when small metal pads require a controlled volume of a reflowable metal. The resin is preferably photodefined to eliminate recessed areas around the metal pads, thereby promoting definition of the metal features, and yielding a nearly planar surface. Additional features that can be provided with the method include external conductive ground planes and electromagnetic shield layers within a multilayer circuit board. The masking method can be advantageously used with both reflowable metals and metal alloys, such as tin/lead, and nonreflowable metals and metal alloys, such as gold, palladium and platinum.

REFERENCES:
patent: 3649274 (1972-03-01), Older et al.
patent: 4902610 (1990-02-01), Shipley
patent: 5162144 (1992-11-01), Brown et al.
patent: 5246817 (1993-09-01), Shipley, Jr.
patent: 5260170 (1993-11-01), Brown

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