Solder mask for manufacture of printed circuit boards

Details Solder mask for manufacture of printed circuit boards Solder mask for manufacture of printed circuit boards

1995-12-11

1997-05-06

Breneman, R. Bruce

Etching a substrate: processes

Masking of a substrate using material resistant to an etchant

Mask is multilayer resist

216 49, 216 18, 216 20, 430312, 430314, 430318, G03F 700

Patent

active

056267746

ABSTRACT:
A permanent solder mask is applied to the surface of a printed circuit board using a copper foil carrier. The solder mask preferably is one or two layers of a thermosetting resin e.g. epoxy resin. Selected circuit features are exposed by etching away portions of the copper foil and removing the underlying thermosetting resin. Then, the remaining copper foil is removed, leaving the solder mask on the surface of the printed circuit board.

REFERENCES:
patent: 4980016 (1990-12-01), Tada et al.
patent: 5047114 (1991-09-01), Frisch et al.
patent: 5334487 (1994-08-01), Kindl et al.
patent: 5368884 (1994-11-01), Yamagami et al.

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